[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Investigation of dynamic and mechanical thermal behavior of isotropic conductive adhesives
Durairaj, R., Sean, Chew Chee, Chiun, Tan Chia, Ping, Liew JianYear:
2013
Language:
english
DOI:
10.1109/eptc.2013.6745763
File:
PDF, 2.63 MB
english, 2013