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Airgap Interconnects: Modeling, Optimization, and Benchmarking for Backplane, PCB, and Interposer Applications
Kumar, Vachan, Sharma, Rohit, Uzunlar, Erdal, Zheng, Li, Bashirullah, Rizwan, Kohl, Paul, Bakir, Muhannad S., Naeemi, AzadVolume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2014.2326798
Date:
August, 2014
File:
PDF, 3.97 MB
english, 2014