[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China...

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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Research on dimensional change characteristics of silver halide films for multi-layer PCBs

Zhou, Liangjie, Peng, Weihong, Liu, Dong, Zou, Rubin, Jiang, Xuefei, Xia, Weisheng, Wu, Fengshun
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Year:
2011
Language:
english
DOI:
10.1109/icept.2011.6066931
File:
PDF, 1.50 MB
english, 2011
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