Effect of Thermal Aging and Salt Spray Testing on Reliability and Mechanical Strength of Sn–58Bi Lead-Free Solder
Mostofizadeh, Milad, Pippola, Juha, Marttila, Tuomas, Frisk, Laura KatriinaVolume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2267333
Date:
October, 2013
File:
PDF, 7.64 MB
english, 2013