[IEEE 2004 Semiconductor Manufacturing Technology Workshop - Hsinchu, Taiwan (9-10 Sept. 2004)] 2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) - A study of the fabrication of flip-chip bumps using dry-film photoresist process on 300 mm wafer
Zhi-Ting Ke,, Cheng-Shih Lee,, Keng-Huei Shen,, Chang, E.Y.Year:
2004
Language:
english
DOI:
10.1109/smtw.2004.1393724
File:
PDF, 293 KB
english, 2004