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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Evaluation of tin-whisker growth during thermal-cycle testing using stress- and mass-diffusion analysis
Takeshi Terasaki,, Tomio Iwasaki,, Yasutaka Okura,, Tomohisa Suzuki,, Takahiko Kato,, Masato Nakamura,, Tomoaki Hashimoto,Year:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074028
File:
PDF, 1.38 MB
english, 2009