[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Pd coated Cu wire bond on XoAA material in LQFP package
Wang Mei Yong,, Teo, Jude, Gan Swee Lee,, Tan Kian Heong,, Swee, AudreyYear:
2012
Language:
english
DOI:
10.1109/iemt.2012.6521840
File:
PDF, 1.20 MB
english, 2012