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[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Lead-free and halogen free solder flip chips on board using SMT processes and materials for miniaturization and lower cost
Sjoberg, Jonas, Aranda, Ranilo, Pang, Dick, Geiger, David A., Kurwa, MuradYear:
2013
Language:
english
DOI:
10.1109/eptc.2013.6745767
File:
PDF, 2.36 MB
english, 2013