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[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - The role of Cu-Al IMC coverage and aluminum splash in Pd-copper wire HAST performance
Han, Ming-chuan, Li, Jun, Yan, Bei-Yue, Yao, J. Z., Song, Mei-JiangYear:
2013
Language:
english
DOI:
10.1109/eptc.2013.6745748
File:
PDF, 1.26 MB
english, 2013