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[IEEE 2008 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2008.12.15-2008.12.17)] 2008 IEEE International Electron Devices Meeting - High performance Cu interconnects with damage-less full molecular-pore-stack (MPS) SiOCH for 32nm-node LSIs and beyond
Ueki, M., Tagami, M., Ito, F., Kume, I., Yamamoto, H., Kawahara, J., Inoue, N., Hijioka, K., Takeuchi, T., Saito, S., Onodera, T., Furutake, N., Okada, N., Hayashi, Y.Year:
2008
Language:
english
DOI:
10.1109/iedm.2008.4796767
File:
PDF, 981 KB
english, 2008