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Methodology for characterization of high-speed multi-conductor metal interconnections and evaluation of measurement errors
Palusinski, O.A., Znamirowski, L., Reiss, K., Grabinski, H.Volume:
25
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2002.806740
Date:
August, 2002
File:
PDF, 621 KB
english, 2002