Nondestructive measurement of bond line thickness and die...

Nondestructive Testing And Evaluation 2008 / 06 Vol. 23; Iss. 2

Nondestructive measurement of bond line thickness and die tilt in the die attach for semiconductor packaging

Chang, Ming, Deka, Juti Rani, Tseng, Kai-Ming
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
23
Language:
english
Journal:
Nondestructive Testing and Evaluation
DOI:
10.1080/10589750701775700
Date:
June, 2008
File:
PDF, 424 KB
english, 2008
Conversion to is in progress
Conversion to is failed