![](/img/cover-not-exists.png)
[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Stacked BGA design, development, and materials selection considerations for improved testing and stacking, reduced warpage and environmental stress, and enhanced thermal qualities
Tan Yong Kian,, Tay Wuu Yean,, Lee Kian Chai,, Ng Hong Wan,Year:
2003
Language:
english
DOI:
10.1109/eptc.2003.1271621
File:
PDF, 383 KB
english, 2003