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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Development of Evaluation Approach for Delamination Considering Micro-Scale Interfacial Layer Structure between Resin and Silicon
Matsumoto, Tsubasa, Yu, Qiang, Shibutani, Tadahiro, Matsuzaki, TomioYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763532
File:
PDF, 2.86 MB
english, 2008