Ecodesigns and applications for noble metal nanoparticles by ultrasound process
Hayashi, Y., Takizawa, H., Inoue, M., Niihara, K., Suganuma, K.Volume:
28
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2005.858452
Date:
October, 2005
File:
PDF, 1.37 MB
english, 2005