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Effects of copper interlayer on deposition and flexibility improvement of diamond microelectrode
Long, Hangyu, Wang, Jingqing, Zhang, Xiongwei, Luo, Hao, Luo, Jiaqi, Deng, Zejun, Q.P.Wei,, Z.M.Yu,Volume:
258
Language:
english
Journal:
Surface and Coatings Technology
DOI:
10.1016/j.surfcoat.2014.07.078
Date:
November, 2014
File:
PDF, 1.18 MB
english, 2014