[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Study of creep performance of Sn-0.7Ag-0.5Cu-3.5Bi-0.05Ni/Cu by nanoindentation
Miaosen, Yang, Fenglian, Sun, Xia, LiYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756636
File:
PDF, 501 KB
english, 2013