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[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Self-aligned through silicon vias in ultra-thin chips for 3D-integration
Ferwana, Saleh, Harendt, Christine, Letzkus, Florian, Burghartz, Joachim N.Year:
2012
Language:
english
DOI:
10.1109/estc.2012.6542114
File:
PDF, 9.44 MB
english, 2012