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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Fundamental Research of No-Flow UF for Low Stress Flip-Chip Package
Kawamoto, Satomi, Suzuki, Osamu, Abe, Yukinari, Yoshii, Haruyuki, Fujiki, Tatuhiro, Tanaka, FumioYear:
2006
Language:
english
DOI:
10.1109/hdp.2005.251388
File:
PDF, 808 KB
english, 2006