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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Rate-dependent properties of Sn-Ag-Cu based lead free solder joints
Su, Yong'An, Tan, Long Bin, Tan, Vincent B.C., Tee, Tong YanYear:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416537
File:
PDF, 1.09 MB
english, 2009