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[IEEE Electrical Performance of Electronic Packaging - Princeton, NJ, USA (2003.10.27-2003.10.29)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system

Youchul Jeong,, Hyungsoo Kim,, Jingook Kim,, Jongbae Park,, Joungho Kim,
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Year:
2003
Language:
english
DOI:
10.1109/epep.2003.1250031
File:
PDF, 256 KB
english, 2003
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