[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - Electromigration reliability of dual damascene copper interconnect with different IMD structures
Young-Jin Wee,, Ki-Chul Park,, Won-Sang Song,, Hyeon-Deok Lee,, Wo-Kyu Kang,, Joo-Tae Moon,Year:
2001
Language:
english
DOI:
10.1109/iitc.2001.930078
File:
PDF, 331 KB
english, 2001