Self-Aligned Wafer-Level Integration Technology With...

IEEE Transactions on Advanced Packaging 2007 / 02 Vol. 30; Iss. 1

Self-Aligned Wafer-Level Integration Technology With High-Density Interconnects and Embedded Passives

Sharifi, Hasan, Choi, Tae-Young, Mohammadi, Saeed
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2006.890221
Date:
February, 2007
File:
PDF, 922 KB
english, 2007
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