[IEEE 2014 IEEE 64th Electronic Components and Technology...

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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Effect of high temperature storage on the stress and reliability of 3D stacked chip

Jiang, Tengfei, Wu, Chenglin, Su, Peng, Chia, Pierre, Li, Li, Son, Ho-Young, Suh, Min-Suk, Kim, Nam-Seog, Im, Jay, Huang, Rui, Ho, Paul S.
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Year:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897430
File:
PDF, 2.90 MB
english, 2014
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