Verification of Snapback Model by Transient $I$–$V$...

IEEE Transactions on Device and Materials Reliability 2013 / 06 Vol. 13; Iss. 2

Verification of Snapback Model by Transient $I$–$V$ Measurement for Circuit Simulation of ESD Response

Meng, Kuo-Hsuan, Rosenbaum, Elyse
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Volume:
13
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2013.2258672
Date:
June, 2013
File:
PDF, 1.30 MB
english, 2013
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