Impacts of Cu Contamination on Device Reliabilities in 3-D...

IEEE Transactions on Device and Materials Reliability 2014 / 3 Vol. 14; Iss. 1

Impacts of Cu Contamination on Device Reliabilities in 3-D IC Integration

Kang-Wook Lee,, Ji-Chel Bea,, Ohara, Yuki, Murugesan, Mariappan, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, Mitsumasa
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Volume:
14
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2013.2258022
Date:
March, 2014
File:
PDF, 2.26 MB
english, 2014
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