Robust superconducting die attach process
Yokoyama, K.E., Akerling, G., Smith, A.D., Wire, M.Volume:
7
Language:
english
Journal:
IEEE Transactions on Appiled Superconductivity
DOI:
10.1109/77.621779
Date:
June, 1997
File:
PDF, 543 KB
english, 1997