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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - A new era in manufacturable, low-temperature and ultra-fine pitch Cu interconnections and assembly without solders
Smet, Vanessa, Kobayashi, Makoto, Wang, Tao, Raj, Pulugurtha Markondeya, Tummala, RaoYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897328
File:
PDF, 2.21 MB
english, 2014