![](/img/cover-not-exists.png)
Bed of Springs for Packaging of Microstrip Circuits in the Microwave Frequency Range
Rajo-Iglesias, Eva, Kildal, Per-Simon, Zaman, Ashraf Uz, Kishk, AhmedVolume:
2
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2012.2207957
Date:
October, 2012
File:
PDF, 1.11 MB
english, 2012