[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Packaging Design and Testing for High Temperature Applications > 15 �C
Schreier-Alt, Thomas, Rebholz, ChristianYear:
2007
Language:
english
DOI:
10.1109/esime.2007.360023
File:
PDF, 7.08 MB
english, 2007