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The interplay between interface structure, energy level alignment and chemical bonding strength at organic–metal interfaces
Willenbockel, M., Lüftner, D., Stadtmüller, B., Koller, G., Kumpf, C., Soubatch, S., Puschnig, P., Ramsey, M. G., Tautz, F. S.Volume:
17
Year:
2015
Language:
english
Journal:
Phys. Chem. Chem. Phys.
DOI:
10.1039/C4CP04595E
File:
PDF, 5.70 MB
english, 2015