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[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Plasma treatment after interconnect metal etch for recovery of plasma charge-induced damages
Shin Seung Park,, Chang Ju Choi,, Jin Woong Kim,, Jeong Mo Hwang,Year:
2000
Language:
english
DOI:
10.1109/iitc.2000.854307
File:
PDF, 317 KB
english, 2000