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[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Influence of plasma treatment and cleaning on vacuum wafer bonding
Wei Bo Yu,, Cher Ming Tan,, Jun Wei,, Shu Sheng Deng,, Mui Ling Nai,Year:
2003
Language:
english
DOI:
10.1109/eptc.2003.1271532
File:
PDF, 227 KB
english, 2003