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Moisture-Induced Delamination in Plastic Encapsulated...

Moisture-Induced Delamination in Plastic Encapsulated Microelectronic Devices: A Physics of Failure Approach

Alpern, Peter, Lee, Kheng Chooi
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Volume:
8
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2008.2002340
Date:
September, 2008
File:
PDF, 740 KB
english, 2008
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