Moisture-Induced Delamination in Plastic Encapsulated Microelectronic Devices: A Physics of Failure Approach
Alpern, Peter, Lee, Kheng ChooiVolume:
8
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2008.2002340
Date:
September, 2008
File:
PDF, 740 KB
english, 2008