Broadband Microwave Frequency Characterization of 3-D Printed Materials
Deffenbaugh, Paul I., Rumpf, Raymond C., Church, Kenneth H.Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2013.2273306
Date:
December, 2013
File:
PDF, 3.01 MB
english, 2013