Analysis of TAB inner lead fatigue in thermal cycle...

IEEE Transactions on Components Packaging and Manufacturing Technology Part A 1995 / 3 Vol. 18; Iss. 1

Analysis of TAB inner lead fatigue in thermal cycle environments

Cluff, K.D.
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Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.370742
Date:
March, 1995
File:
PDF, 716 KB
english, 1995
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