[IEEE 53rd Electronic Components and Technology Conference,...

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - The study on the improvement of lead broken failure in TCP using new Sn pre-plating method

Dea-Woo Son,, Kwan-Jae Lee,, Ji-Hwan Hwang,, Si-Hoon Lee,, Ye-Chung Chung,, Kang, S.Y.

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Year:

2003

Language:

english

DOI:

10.1109/ectc.2003.1216491

File:

PDF, 538 KB

english, 2003

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