[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Development of exposed die large body to die size ratio wafer level package technology
Osenbach, J., Emerich, S., Golick, L., Cate, S., Chan, M., Yoon, S. W., Lin, Y. J., Wong, K.Year:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897403
File:
PDF, 1.79 MB
english, 2014