[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Real time stress monitoring in reflow solder: Cu thin films in Si(111)
Li Song,, An Bing,, Zhang Tong-jun,, Wu Yi-ping,, Dai Wei,Year:
2005
Language:
english
DOI:
10.1109/icept.2005.1564607
File:
PDF, 391 KB
english, 2005