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[IEEE 2004 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Atlanta, GA, USA (24-26 March 2004)] 2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat. No.04EX745) - Application of Au-Sn eutectic bonding in hermetic RF MEMS wafer level packaging
Woonbae Kim,, Qian Wang,, Kyudong Jung,, Junsik Hwang,, Changyoul Moon,Year:
2004
Language:
english
DOI:
10.1109/isapm.2004.1288016
File:
PDF, 1.69 MB
english, 2004