Novel Electrical and Fluidic Microbumps for Silicon...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 5 Vol. 4; Iss. 5

Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs

Zheng, Li, Zhang, Yue, Huang, Gang, Bakir, Muhannad S.
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2014.2309680
Date:
May, 2014
File:
PDF, 7.18 MB
english, 2014
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