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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - An idealized shape of CuCGA solder joint and its load-carrying advantage
Zhili, Zhao, Xirui, Xu, Fenglian, Sun, Zhili, ZhaoYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756514
File:
PDF, 449 KB
english, 2013