[IEEE 2012 13th International Conference on Electronic...

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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Investigation of palladium coverage on free air balls of palladium-coated copper wires

Pu, Haonan, Lo, Tawei, Wang, Techun, Wang, Jiaji
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Year:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474802
File:
PDF, 979 KB
english, 2012
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