[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Investigation of palladium coverage on free air balls of palladium-coated copper wires
Pu, Haonan, Lo, Tawei, Wang, Techun, Wang, JiajiYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474802
File:
PDF, 979 KB
english, 2012