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[IEEE Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Effects of ball pad configuration on joint reliability in BGA chip-scale packages
Chong, V., Lee Teck Kheng,, Dewi Kartika Gunawan,, Lim Chwee Teck,Year:
2004
Language:
english
DOI:
10.1109/eptc.2004.1396704
File:
PDF, 350 KB
english, 2004