[IEEE 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (2006.7.3-2006.7.3)] 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Simulation of Texture Development Caused Stress Build-Up in Electroplated Copper Lines
Ceric, H., Hollauer, Ch., Selberherr, S.Year:
2006
Language:
english
DOI:
10.1109/ipfa.2006.250987
File:
PDF, 1.40 MB
english, 2006