[IEEE IEEE International Electron Devices Meeting - San Francisco, CA, USA (8-11 Dec. 2002)] Digest. International Electron Devices Meeting, - Cost-effective "BARC/resist-via-fill free" integration technology for 0.13 μm Cu/low-k
Soo-Geun Lee,, Kyoung-Woo Lee,, Il-Goo Kim,, Wan-Jae Park,, Young-Jin Wee,, Won-Sang Song,, Jae-Hak Kim,, Seung-Jin Lee,, Hyeok-Sang Oh,, Yong-Tak Lee,, Joo-Hyuk Chung,, Ho-kyu Kang,, KwanYear:
2002
Language:
english
DOI:
10.1109/iedm.2002.1175910
File:
PDF, 241 KB
english, 2002