[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Analysis of the phenomenon of falling off of indium bumps from substrate during reflow process
Qiuping Huang,, Dongliang wang,, Gaowei Xu,, Yuan Yuan,, Quan wang,, Le Luo,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582421
File:
PDF, 1.05 MB
english, 2010