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[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Integration of III–V materials and Si-CMOS through double layer transfer process
Kwang Hong Lee,, Shuyu Bao,, Fitzgerald, Eugene, Chuan Seng Tan,Year:
2014
Language:
english
DOI:
10.1109/ltb-3d.2014.6886171
File:
PDF, 365 KB
english, 2014