[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Embed glass interposer to substrate for high density interconnection
Hu, Dyi-Chung, Hung, Yin-Po, Chen, Yu-Hua, Tain, Ra-Min, Lo, Wei-ChungYear:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897312
File:
PDF, 2.60 MB
english, 2014