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[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Numerical Analysis of the Reliability of Cu/low-k Bond Pad Interconnections Under Wire Pull Test: Application of a 3D Energy Based Failure Criterion
Gallois-Garreignot, Sebastien, Fiori, Vincent, Orain, Stephane, van der Sluis, OlafYear:
2007
Language:
english
DOI:
10.1109/esime.2007.359940
File:
PDF, 8.00 MB
english, 2007